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		<title>AMD and IBM Announce Low K Dielectric Breakthrough in Future 45nm ICs</title>
		<description>Comments for AMD and IBM Announce Low K Dielectric Breakthrough in Future 45nm ICs</description>
		<link>http://vmenow.com/c</link>
		<lastBuildDate>Tue, 07 Sep 2010 02:11:02 +0100</lastBuildDate>
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			<title>...</title>
			<link>http://vmenow.com/c/index.php?option=com_content&quot;&amp;amp;&quot;task=view&quot;&amp;amp;&quot;id=80&quot;&amp;amp;&quot;Itemid=46#pc_49</link>
			<description>&quot;The lower the dielectric constant K, the less chance of capacitive tunneling between the gate channel to the substrate&quot; doesn't make sense. gate tunneling is a feol issue, usually addressed bu the use of high-k. low-k is a beol material to reduce wiring cap.</description>
			<pubDate>Sat, 12 May 2007 05:41:16 +0100</pubDate>
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